Advantages of Rotary Sputtering Targets vs. Planar ...

I have been asked to explain why someone would want to use rotary sputtering targets instead of planar sputtering targets.

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Certainly there is some expense involved with larger targets and new equipment (assuming you are currently using a planar system), but in a high volume process (such as roll-to-roll thin film deposition) the advantages lead to a lower cost of ownership:

• Compared to planar targets, rotary targets generally have more surface area per given length.

• Rotary targets have much more surface area, so the magnetron power can be spread out over a larger area in a given amount of time. This helps keep the target running cooler, decreases nodule formation, and reduces the occurrence of arcing.

1. Since rotary sputtering decreases nodule formation, targets can have longer continuous runtimes.
2. There is generally more material available to sputter on a rotary target, which increases runtimes.
3. Rotary target utilization is usually ~80%, as opposed to ~30% for planar targets &#; which decreases scrap and increases runtimes.

• Rotary targets are well suited for continuous sputtering processes. Continuous processing increases throughput since there is less time wasted preparing the sputtering chamber.

• Rotary targets are more cost effective for high volume processes. They provide a good platform for long runtime processes, with less chance of defects and downtime.

If you want to learn more, please visit our website Acetron.

• Planar targets are still best suited for prototype work or elemental experimentation, especially when large amounts of material are not needed at once.

If you are interested in discussing sputtering targets, contact our team at:

~Jim

Authored by previous Indium Application Manager Jim Hisert

Maximum purity

Our targets fulfill the most stringent purity requirements. The main advantages: excellent electrical conductivity of the layer and minimum particle formation during the PVD process. Metal and non-metal impurities in the sputtering target are transferred to the sputtered functional layer, thereby affecting its function or causing particle formation in the PVD process (the so-called arcing effect). We guarantee that our tungsten targets are at least 99.97% pure. The typical purity of our tungsten targets is even higher at 99.99%. This is how we guarantee that the layers produced satisfy the stringent requirements particularly for use in microelectronics.

Maximum density and homogeneous microstructure

Tungsten sputtering targets from Plansee are highly compressed by means of special forming processes. The advantage for the PVD coating process is homogeneous coating rates and improved coating properties. This results in improved efficiency and output in the production of thin films. Our powder metallurgical manufacturing process enables us to adjust the microstructure of the coating material to the specific application.

For more metal sputtering targetinformation, please contact us. We will provide professional answers.