Sputter coating is the core thin film deposition process in the semiconductor, disk drive, CD and optics industries today.
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When a suitable gas (usually argon) and a target material (usually metals) are used to form a glow discharge between the cathode and the anode, the sputtering target is bombarded to cause the atoms to be ejected from the target material&#;&#;the process is referred to as &#;sputtering&#;; the atoms of the sputtering target will be deposited on a substrate, such as a silicon wafer, solar panel or optical device, and this process is known as sputter deposition.
Sputter deposition, as a relatively common physical vapor deposition (PVD) method, has its advantages, such as a wide range of deposition materials and high coating quality.
The table below details the advantages and disadvantages of sputter coating. It is provided by Stanford Advanced Materials and is for informational purposes only.
Advantages Disadvantages (1) Able to deposit a wide variety of metals, insulators, alloys and composites.(2) Replication of target composition in the deposited films.
(3) Capable of in-situ cleaning prior to film deposition by reversing the potential on the electrodes .
(4) Better film quality and step coverage than evaporation.
(5) This is partly because adatoms are more energetic, and film is &#;densified&#; by in-situ ion bombardment, and it is easier to heat up to high T than evaporation that is in vacuum.
(6) More reproducible deposition control &#; same deposition rate for same process parameters (not true for evaporation), so easy film thickness control via time.
(7) Can use large area targets for uniform thickness over large substrates.
(8) Sufficient target material for many depositions.
(9) No x-ray damage.
(1) Substrate damage due to ion bombardment or UV generated by plasma.(2) Higher pressures 1 &#;100 mtorr ( < 10-5 torr in evaporation), more contaminations unless using ultra clean gasses and ultra clean targets.
(3) Deposition rate of some materials quite low.
(4) Some materials (e.g., organics) degrade due to ionic bombardment.
(5) Most of the energy incident on the target becomes heat, which must be removed.
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SAM Sputter TargetsDiscover Sputtering Targets from Testbourne
Testbourne is a leading provider of sputtering targets. Sputtering is a technology proven to be capable of depositing thin films from a variety of materials into different shapes and sizes materials. This process can be scaled up to include small research or large manufacturing processes. Discover more about the types of sputtering targets we provide and the different materials available from Testbourne.
Sputtering targets are materials that are used to create thin films in a process called sputter deposition. Sputtering targets are used to produce low-radiation coated glass, used in building construction due to its renewable energy properties, such as saving energy, saving light and for aesthetics.
Our sputtering targets can be produced from a wide range of materials, such as metals and compounds, using processes including rotatable target technology. The choice of material very much depends on the desired properties of the thin film, such as conductivity, renewability, or optical properties.
We offer 3 main types of sputtering targets:
Metal sputtering targets are made from pure metals, such as aluminium, copper, gold, silver, titanium, or metal alloys. Pure metals are most commonly used in the production of electronic devices, such as semi-conductors. Whereas metal alloys are used more commonly in the production of wear-resistant coatings for cutting tools, and biomedical or aerospace components.
At Testbourne our metal targets are offered in various purity levels to suit your specific requirements. Our manufacturing processes for metal sputtering targets depend on the properties of the target metal and its application and thus the fabrication methods we use vary from vacuum melting and rolling, to hot-pressed, vacuum hot-pressed and forged.
Compound sputtering targets are frequently used in industries, including semiconductors, and optical coatings.
The use of compound sputtering targets has several advantages over metal targets, including the ratio of the different elements in the film that can significantly affect its chemical, electrical and optical properties. Also, in comparison to metal sputtering targets, compound targets have a higher durability, so they are more resistant to erosion and cracking.
Testbournes' compound target production methods vary from vacuum hot pressing, hot isostatic pressing, cold isostatic pressing, and cold press sintering, depending on the required metal targets.
Rotatable sputtering targets have a cylindrical shape and are usually made up of metal or ceramic materials. The most common targets are available in chromium, tin, zinc and niobium alloys. Rotatable target technology has been highly used in large area coating manufacturing of architectural glass and flat panel displays. They get their name from the way they rotate during the sputtering process, allowing for a longer target life.
Using rotatable sputtering targets has advantages over other sputtering targets as they allow the use of higher densities because of the even spread of heat build-up over the target surface area. Additionally, they can improve the quality of deposited films, making them a popular choice in industries such as electronics, optics and semiconductors.
Unsure if Testbourne has the right materials for you? We offer a broad range of scientific materials with bespoke options. Get in touch with our team and we can discuss your sputtering target requirements.