Our targets fulfill stringent purity requirements. The main advantages: excellent electrical conductivity of the layer and minimum particle formation during the PVD process. Metal and non-metal impurities in the sputtering target are transferred to the sputtered functional layer, thereby affecting its function or causing particle formation in the PVD process (arcing effect).
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We guarantee that our molybdenum targets have a minimum purity of 99.97%. The typical purity of our molybdenum targets is 99.99%. This is how we guarantee that the layers produced satisfy the stringent requirements.
Our molybdenum sputtering targets are highly consolidated by means of special forming processes. This results in increased coating rates and improved coating properties in the PVD coating process. The advantages of this lie in the efficiency of the thin film production as well as a high output.
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We can adjust the microstructure of the coating material in a targeted manner by means of our manufacturing process. With an evenly formed microstructure of the sputtering targets, you can achieve consistent sputtering rates and film thicknesses.
In the PVD coating process, everything must be perfectly matched. It is only if all process parameters are perfectly matched that the layer that suits the customer's exact requirements can be produced. We carry out sputtering under practical conditions in our PVD application laboratory. Our developer team creates layers here and analyzes them in detail according to defined specifications. This means that new coating materials are developed in a very short time in cooperation with customers and numerous development partners. Having worked with system manufacturers and OEMs for several years, we are directly involved in the latest developments and optimizations
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