Diamond wire sawing is the most flexible cutting method in the field of quality assurance for component and material analysis. Thinnest cut-offs between 0.08 and 0.5 mm are possible. Due to the "gentle" cut, there is no significant heat input, so that even temperature-sensitive parts such as rubber can be cut. Both wet and dry cutting is possible. The cut-offs are usually precise, even and smooth. The cut edges are sharp-edged - without bridging. When cutting composite materials, there is no smearing between the different materials. Cutting heights of up to 375 mm are no problem. A disadvantage could be the cutting time due to the low feed rate, but this is less important in laboratories.
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Due to these properties and the simple and safe operation of a diamond wire saw, more and more laboratories around the world are opting for this cutting technology or are supplementing their machine portfolio with it.
Publish date&#;-05-21 13:01:49
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A diamond wire saw is a cutting device that uses a metal wire embedded with diamond particles as a cutting tool. It is formed by binding a series of metal wires with rubber or plastic material, and the diamond particles are evenly distributed on the metal wires. Diamond wire saws are often used to cut hard materials such as marble, granite, concrete, bricks, and rocks.
The working principle of diamond wire saw is to grind and cut materials through the hardness and sharpness of diamond particles. When the wire saw passes through the material during the cutting process, the diamond particles will grind and wear the surface of the material to achieve the purpose of cutting. Wire saws can cut by pulling, looping, or reciprocating motions.
Diamond wire saw has the following advantages:
1: It can cut all kinds of hard materials, including stone, concrete, rock and so on.
2: The cutting speed is fast, which can realize efficient cutting operations.
3: The vibration and noise generated during the cutting process are relatively small.
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4: The surface after cutting is smooth, reducing the workload of subsequent processing.
5: The cutting width is adjustable, and precise cutting can be carried out according to the needs.
Diamond wire saws are widely used in stone processing, construction, demolition, mining and other industries, especially for occasions where large-sized and complex-shaped materials need to be cut.
What is the cutting principle of diamond wire saw?
The cutting principle of diamond wire saw is to use the hardness and sharpness of diamond particles to grind and cut materials. Diamond is the hardest natural substance known so far and has excellent cutting properties.
In a diamond wire saw, diamond particles are embedded in the metal wire, forming the cutting edge of the cutting tool. When the wire saw is running, the diamond particles touch the surface of the material to be cut, and produce grinding action on the surface of the material through rotation or circular motion. The hardness and sharpness of the diamond particles allow them to grind and abrade the structure of the material to achieve the cutting effect.
During the cutting process, diamond particles will rub and wear against the surface of the material being cut, gradually reducing the volume of the material. Through continuous cutting motion, the diamond wire saw can cut the material into the desired shape and size along the predetermined cutting path.
The cutting principle of the diamond wire saw is based on the hardness and sharpness of the diamond particles, and the cutting is achieved by grinding and abrading the surface of the material. This cutting method has advantages when dealing with hard materials and large workpieces, and can complete the cutting task efficiently.
All in all, the diamond wire saw is a tool that continuously grinds and cuts objects through beading, and is continuously pulled back by the driving force of the wire saw machine. It is a tool that continuously completes the grinding process. At present, it gradually replaces some other sawing or mining methods and has become mainstream diamond cutting tools.
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