In Mold Electronics is achieved by using special inks to print on thin plastic films, which are then formed and trimmed to match the geometry of the final molded product surfaces. The formed film is loaded into the custom plastic injection molding tool and then over-molded encapsulating all circuitry and graphics. The second surface printing of the circuitry and graphics allows designers to incorporate touch controls and lighting using manufacturing methods commonly used in the In Mold Decorating (I.M.D.) process.
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Launching an I.M.E. project requires competence in several design and manufacturing processes including circuit design, flexible circuit printing, graphic distortion, forming/trimming of printed film and specialty injection molding.
Some of the possibilities include;
Proximity Sensing
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Capacitive Touch
Haptic Response
Near Field Communication
Back Lighting
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